Next Generation Sintering Technologies

Our novel silver sintering pastes enable electronic connections with maximum heat conduction.
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Applications in
12x Lower Electrical Resistance Made to optimize electrical conductivity More
20x Better Thermal Conductivity Assures an optimal heat flow More
10x Longer Lifetime Of Connections Designed for maximum durability More
In comparison to industry-standard Pb/Sn solder pastes

News

June2019

Find us at the LASER at 24th to 27th April in Munich, Booth B2.119.

April2019

Find us at the IDTechEX Show at 10th+11th April in Berlin, Booth B01.

February 2019

We are joining the ECP in Frankfurt at 26th of February.

January 2019

New company location in Berlin-Adlershof.

January 2019

Dr. Adrian Stelzer was appointed as second CEO.

September 2018

Join the ECP Summer Summit.

June 2018

Won 3rd Place at Raw Material Summit 2018.

June 2018

Approval of the US patent of Nano-Join.

June 2018

New company presentation video is online.

June 2018

We are at the PCIM and SMT in Nuremberg.

March 2018

We are at the IMAPS at Frauenhofer IZM in Berlin.

February 2018

We are as exhibitors and at the partnering at ECP - European Chemistry Partnering.

November 2017

We are joining Produktronika in Munich as both participants and exhibitors. Come and visit us!

Oktober 2017

We were awarded the Henkel Start-Up Certificate within the scope of AdMaCom.

September 2017

We have been confirmed for phase 3 of the Climate-KIC accelerator!
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